Fundamentals of Wafer Bonding:
Wafer Level 3D Integration Enabled by Low Temperature Bonding Technology [Keynote]
Ionut Radu, Mariam SADAKA, SOITEC
Hydrophobic Wafer Bonding and Characterization of the Interface Dislocations
Manfred Reiche, Max-Planck Institut für Mikrostrukturphysik, Halle
Low-temperature Bonding:
Low Temperature Bonding of Thermally Mismatched Substrates [Keynote]
Shari Farrens, SUSS MicroTec
Low Temperature Direct Oxide Bonding (ZiBond) and Direct Bond Interconnect (DBI)
Paul Enquist, Ziptronix, Inc.
Low Temperature Plasma or CMP Assisted Direct Bonding
H. Moriceau, F. Rieutord, L. Di Cioccio, P. Gueguen, S. Pocas, F. Fournel, C. Morales, CEA, LETI, MINATEC
Status of low temperature wafer bonding using reactive multilayer films
B. Boettge*1, M. Petzold*1, M. Wiemer*2 and J. Bagdahn*3
*1 Fraunhofer IWM; *2 Fraunhofer ENAS;*3 Fraunhofer CSP
Nanoporous Gold for Low Temperature Bonding
Hermann Oppermann, Fraunhofer IZM Berlin
Atomic Diffusion Bonding of Wafers with Thin Nanocrystalline Metal Films
T. Shimatsu and M. Uomoto, Tohoku University, RIEC
3D integration by Low temperature / Wafer Bonding:
3D System Integration: Interconnect Requirements and Processes [Keynote]
Eric Beyne, IMEC
Low Temperature Die-Level Bonding for 3D Packaging, 3D Stacked Integrated Circuits and 3D Silicon Interposers
Dorota Tempel, RTI
Temporary Wafer Bonding for Wafer Thinning and Backside Processing - Key Technology for 3D System Integration
K. Zoschke, M J. Wolf, O. Ehrmann, H. Reichl, Fraunhofer IZM
3D Stacking of Multiple Silicon Plates using Direct Wafer Bonding for novel lightweight focusing X-ray optics
R. Gunther, M. Ackermann and M. Collon, Cosine Research BV
Layer Transfer in Wafer Bonding:
Understanding Strain and Strain Relaxation during Layer Transfer and Patterning in Wafer Bonding[Keynote]
Helmut Baumgart, Old Dominion University
Germanium to Silicon Low Temperature Direct Bonding and Layer Transfer Using Remote Plasma Activation
Cindy Colinge, Tyndall National Institute
Wafer Bonding Applications:
Low temperature wafer bonding processes and their application to microfabrication
Alain Bosseboeuf, University Paris South
Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication: Challenges and Promises
Viorel Dragoi, EV Group
Low temperature direct wafer bonding process for back side illumination image sensors and 3D stacking
Arnaud CASTEX, Marcel Broekaart, Laurent Marinier, Eric Neyret, Sébastien Golliet, Myriam Haye, Emmanuel Davienne, Sébastien Molinari, Muriel Martinez, Stéphanie Signamarcheix, Richard Fontanière, Chrystelle Lagahe, SOITEC
Direct Wafer Bonding of ALD Al2O3
T. Suni*1,*3, R. L. Puurunen*1, O. Ylivaara*1, K. Henttinen*2, T. Ishida*3, H. Fujita*3, 1* VTT Technical Research Centre of Finland, 2* Okmetic Oyj, 3* University of Tokyo
Surface Activated Bonding:
Cu Direct Bonding in Ampbient Air – A Review of the Surface Activated Bonding
Tadatomo Suga, The University of Tokyo; Akitsu Shigeto, NIMS
Temperature Compensated LiTaO3/Sapphire SAW Devices Using Surface Activated Bonding
M. Miura, T. Matsuda, M. Ueda, Y. Satoh*1, T. Nishizawa*2, and H. Takagi*3, 1* FUJITSU LABORATORIES Ltd., 2* FUJITSU MEDIA DEVICES Ltd., 3* National Institute of Advanced Indurial Technology.
Bumpless Wafer Level Bonding for Vertical Integration MEMS
Makoto Moriguchi, OMRON Co.
Investigation of Adhesion in Clad Materials by SAB Method and its Application in Volume Productions
Hironao Okayama, Technical Research Laboratory, Toyo Kohan Co., Ltd.
Low Temperature Process for Micro-assembly of Opto-Microsystems using Surface Activated Bonding Method
Eiji Higurashi, The University of Tokyo
Novel Low Damage and Low Temperature Direct Wafer Bonding Processes Using Buried Oxide Protection Layers for Fabricating III-V-On-Insulator on Si Structures
Masafumi Yokoyama*1, Tetsuji Yasuda*2, Hideki Takagi*2, Hisashi Yamada*3, Yuji Urabe*2, Hiroyuki Ishii*2, Noboru Fukuhara*3, Masahiko Hata*3, Masakazu Sugiyama*1, Yoshiaki Nakano*1, Mitsuru Takenaka*1, and Shinichi Takagi*1, *1 The University of Tokyo, *2 National Institute of Advanced Industrial Science and Technology, *3 Sumitomo Chemical Co. Ltd.
[Poster & short presentations]
Au-Au thermocompression bonding for 3D MEMS integration with planarized metal structures
Wolfgang Reinert, Claudia Funk, Fraunhofer Institut für Siliziumtechnologie
Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi, Tohoku University
Surface Activated Bonding - Fundamentals; Bonding in Ambient Air; Applications:
Low temperature / room temperature bonding of Si wafer in ambient air and N2
Wang Yinghui, Oshikawa, Tadatomo Suga, The University of Tokyo
Characterization of Surface Profile for Surface Activated Bonding
Kei Tsukamoto, Tadatomo Suga, The University of Tokyo
Low Temperature Bonding of Ge for Infrared Detectors
Ryuji Kurayama*1, Eiji Higurashi*1, Yinghui Wang*1, Tadatomo Suga*1, Yasuo Doi*1, Yoshihiro Sawayama*1 and Iwao Hosako*2
*1 The University of Tokyo, *2 National Institute of Information and Communications Technology,
Room-Temperature Ohmic Contact to n-type GaN for Low-Temperature Direct Metal Bonding
Toru Fukunaga, Eiji Higurashi, and Tadatomo Suga, The University of Tokyo
Room temperature bonding of Cu-Cu single crystaline using SAB
Reona Takagihi, Masatake Akaike, Tadatomo Suga, The University of Tokyo
Surface Activated Bonding – New Equipments:
Development of a new SAB equipment for room temperature bonding
Matiar Howlader*1, Hiroyuki Shintani*2, Tadatomo Suga*2, Akitsu Shigeto*3, Akira Yamauchi*4, 1 McMaster Univeristy, 2 The University of Tokyo, 3 NIMS, 4 Bondtech Co., Ltd.
New Processes:
Release property of PZT films for the embedded substrateK. Iimura*1, T. Hosono*1, K. Kuroki*1, M. Ichiki*1,2, Tadatomo Suga*1, 1 The university of Tokyo, 2 JST-Presto&CREST
Preparation and characteristrics of BaTiO3 ferroelectric films for the embedded substrateT. Hosono*1, K. Iimura*1, K. Kuroki*1, M. Ichiki*1,2, Tadatomo Suga*1, 1 The university of Tokyo, 2 JST-PREST and CREST
Vacuum Ultraviolet Surface Treatment for Cu/Sn Micro-bumpsKatsuyuki Sakuma*1,2, Naoko Unami*1, and Jun Mizuno*1,1 Waseda University, 2 IBM Research - Tokyo
