 |
|
Home | Home Japanese | Sessions and Keynotes | Author's Info | Download
Program | Social Event | Hotel | Location | Registration Committee | Sponsors | Contact |
|
Presentations should cover the newest trend of 3D integration, fundamentals and new processes of SOI and wafer bonding, and development of low-temperature bonding. To activate lively and fruitful discussion, we will publish no proceedings with full papers, but one with technical digests consisting of powerpoint presentation materials. Only 20 presentations except keynotes may be selected for oral presentation because of the limited capacity of the sessions. The other selected contributions are to be presented by short oral presentation combined with poster presentations. IMPORTANT DATES
SUBMISSION OF ABSTRACTS Authors must submit electronically one-page abstract in pdf format via email or via website. The abstract should include sections on objective, approach, results, and conclusions to assist the reviewers in evaluating the suitability of the paper for the sessions in the workshop. Authors will receive electronic notification of acceptance or rejection, and long presentation or short presentation.
SUBMISSION OF FINAL PAPERS / PRESENTATION MATERIALS Authors of accepted presentation must send presentation materials in pdf or ppt format via email or via website below. No proceedings with full papers will be published, but a technical digest complining all abstracts and presentation materials will be distributed to all participants with CD-ROM. Please download authors instruction.
Email for paper submission: 3dwb@su.t.u-tokyo.ac.jp FTP server for paper submission: www.su.t.u-tokyo.ac.jp, |
 |
 |
 |
 |
 |
 |
 |
 |
 |