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Sponsors


Co-sponsor

Institute for Advanced Micro-System Integration (IMSI)

Financial support

The Foundation for Technology Promotion of Electronic Circuit Board

INTERNEPCON JAPAN, Reed Exhibitions Japan Ltd.

Mitsubishi Heavy Industries, Ltd.

DENSO CORPORATION

Cooperation

Japan Institute of Electronics Packaging (JIEP)

Micromachine Center (MMC)

The National Institute of Advanced Industrial Science and Technology



Sponsored by The IEEE Components, Packaging, and Manufacturing Technology Society.


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The background of the title logo LTB-2010 is taken from the pictures designed by Seikan Azuma.