Event Information

[For all participants and accompanied persons]

Open seminar (All participants are invited to audit.)[more info]
18. January, 14:00-18:00
Lectures for graduate students at the School of Engineering, The University of Tokyo
PLACE: Faculty of Engineering Building #11, 1F Auditorium

14:00-16:00
Professor Cindy Colinge, Tyndall National Institute
Low Temperature Direct Wafer Bonding: Mechanisms and Applications
16:00-18:00
Prof. Helmut Baumgart, Old Dominion University
Atomic Layer Deposition (ALD) for Bio-Sensor and Microfluidic Applications

Conference reception
19. January, 18:20-20:00
PLACE: Restaurant Capo PELLICANO

39th INTERNEPCON Japan
20-22. January, Tokyo Big Sight, Reed Exhibisions Japan Ltd.

[Only for invited and keynote speakers]
18. January, 18:20-20:00 Receiption
20. January, 18:20-20:00 Meeting with organizing committee members
21. January, Factory visit and excursion to Kamakura (TBA)