LTB-3D,Japan

Helmut BAUMGART:

Professor, Old Dominion University

Dr. Baumgart is professor of Electrical and Computer Engineering at Old Dominion University in Norfolk, Virginia, where he holds the VMEC Endowed Chair. He received his Ph.D. degree in physics from the University of Stuttgart, Germany (1981)), while performing his Ph.D. research at the Max-Planck Institute of Solid State Research in Stuttgart. Before joining Old Dominion University he has pursued a long career in the high tech industry, where he held numerous R&D positions in the microelectronics industry. He has worked extensively in SOI research at AT&T Bell Laboratories; at Royal Philips Electronics' Briarcliff Research Laboratories and at their Natuurkundig Laboratorium in Eindhoven; at IBM Microelectronics at the Advanced Semiconductor Technology Center (ASTC); at Infineon Technologies in Richmond, and at Motorola's Advanced Products Research & Development Laboratories (APRDL) in Austin. In his research areas he has authored and co-authored over 60 papers, he has published and edited 8 Electrochemical Society Conference Proceedings Volumes; he has delivered 27 conference presentations including numerous invited talks, and holds three U.S. Patents and 15 Patent Disclosures and is the recipient of numerous industry awards.

Cindy Colinge

Professor Tyndall National Institute

Professor Cindy Colinge received her Bachelor of Science in Chemical Engineering 1983 from University of California, Davis, the Master of Science in Electrical and Electronic Engineering 1989 from California State University, Sacramento, and the Doctor of Philosophy in Electrical Engineering 1993 University of California, Davis working on bond and etch-back silicon on insulator.
From August 1993 to the current time she has held the position of Professor in the department of Electrical Engineering at California State University, Sacramento. She is currently on professional leave from the university and is working as a Principal Investigator at Tyndall National Institute in Cork, Ireland where she is studying interfacial properties of bonded heterostructures.This work is funded by the Science Foundation of Ireland. She has had visiting professorships at Naval Research Laboratory (NRL) inWashington, D.C. 20375-5000 from June-Aug. 2003 and has been a consultant for them from 1995-1997. She was a visiting professor and participating guest of Lawrence Livermore National Laboratories from 1995-1997. She was visiting professor at Intel Corp., Santa Clara, California, USA during the summer of 1997 and visiting professor at Chalmers Technical University, Göteborg, Sweden during the summer of 2001.
She is a Senior Member of IEEE since 2003 and a Member Electrochemical Society 1990. She has been and continues to be a member of the organizing committee for the Electrochemical Society's International Symposium on Semiconductor Wafer Bonding Science, Technology, and Application

Manfred REICHE:

Doctor, Max-Planck Institut für Mikrostrukturphysik,Halle

Manfred Reiche is working as a scientific staff member at the Max Planck Institute of Microstructure Physics in Halle. His fields of activity include semiconductor wafer bonding and applications to microsystems technology, optical data communication, and the formation and characterization of advanced substrates (SOI, SSOI, GOI). He received his degree in crystallography from the Humboldt University of Berlin in 1974 and his PhD degree from the University of Leipzig in 1987.

Ionut Radu:

Doctor, Senior staff scientist at SOITEC

Ionut Radu is senior staff scientist at SOITEC since May 2006. Prior to joining SOITEC he spent six years at the Max Planck Institute of Microstructure Physics in Halle (Germany) carrying out research in the field of semiconductor wafer bonding and layer transfer approaches. He obtained his B.S. in physics from University of Bucharest in 1999 and Ph.D (Dr. rer. nat.) in physics from Martin-Luther University Halle-Wittenberg in 2003. He is the co-author of more than 50 scientific papers and holds 3 patents in the field of wafer bonding and Smart Cut^TM technology. His research is focused on advanced wafer bonding and layer transfer techniques for engineered SOI substrates, heterogeneous integration and 3D technologies.

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