May 13-15, 2026
Organizer |
2026 9th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2026)
Kanazawa, Japan |
October 30 - November 1, 2024
Organizer |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2024)
Nara, Japan |
October 5-7 and 11, 2021
Organizer |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)
Online |
May 21-25, 2019
Co-sponsor |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)
Kanazawa, Japan |
May 16-18, 2017
Co-sponsor |
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
The University of Tokyo, Japan |
May 31, 2016
Organizer |
ECTC 2016 Panel Session - Power Module Integration |
July 15-16, 2014
Co-sponsor |
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
The University of Tokyo, Japan |
May 22-23, 2012
Co-sponsor |
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2012)
The University of Tokyo, Japan |
January 19-20, 2010
Co-sponsor |
2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
The University of Tokyo, Japan |
November 8-9, 2007
Co-sponsor |
1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
The University of Tokyo, Japan |
January 16-18, 2007
Co-sponsor |
Polytronic 2007 (IEEE-CPMT) |
