May 22-25, 2019
Co-sponsoring |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)
WaferBond 2019 EAST
|
May 16-18, 2017
Co-sponsoring |
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
|
May 31. 2016
Planning
|
ECTC 2016 Panel Session - Power Module Integration
|
July 15-16, 2014
Co-sponsoring |
4th International IEEE Workshop on Low Temperature Bonding for 3D Integration
|
February 22-23, 2012
Co-sponsoring |
3rd International IEEE Workshop on Low Temperature Bonding for 3D Integration
|
January 19-20, 2010
Co-sponsoring |
2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
|
November 8-9, 2007
Co-sponsoring |
1st International IEEE Workshop on Low Temperature Bonding for 3D Integration
|
January 16-18, 2007
Co-sponsoring
|
Polytronic 2007（IEEE-CPMT）
|
