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LTB-3D 2021 will be held ONLINE.
(Oct. 5-7: Zoom/Webinar, Oct. 11: Zoom/Meeting)

WaferBond 2021 EAST

2021 7th International Workshop
on Low Temperature Bonding for 3D Integration
LTB-3D 2021

Oct. 5-7 and 11, 2021
Nara, Nara-prefecture, Japan

Oct. 4, 2021: Welcome reception
Oct. 5-7, 2021: Keynotes, General session, Short presentation session
Oct. 11, 2021: Satellite Workshop

Important date:

  • Manuscript (one-page summary) Submission Deadline: June 25th, 2021 (closed)
  • Acceptance/Rejection Notification: July 16th, 2021
  • Improved Final version of One-page Summary Deadline: Sept. 10th, 2021
  • Completed Copyright Transfer Form Deadline: Sept. 10th, 2021
  • Presentation Materials Deadline: Sept. 10th, 2021
  • Conference: Oct. 5th-11th, 2021
  • By Nara-City

    Our trip to Nara!

    Sponsored by

    Institute for Advanced Micro-System Integration (IMSI)

    Co-Sponsored by

    Electrochemical Society


    IEEE    EPS Japan Chapter

    Endorsed by

    The Japan Society of Applied Physics

    2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021) will be held ONLINE between Oct. 5-7, 2021 at Nara-city, Japan because of the global COVID-19 epidemic.

    The LTB-3D is a premier conference series sponsored by Institute for Advanced Micro-System Integration (IMSI), and cosponsored by the IEEE EPS Japan Chapter, preceding 1st (2007), 2nd (2010), 3rd (2012), 4th (2014), 5th (2017) in Tokyo, and 6th (2019) in Kanazawa, and in coming 2021, moving to an attractive old city, Nara as WaferBond 2021 EAST in conjunction with WaferBond conferences which are held in Europe every two years: 2009 (Grenoble), 2011 (Chemnitz), 2013 (Stockholm), 2015 (Braunschweig), and 2017 (Leuven), and 2019 (Halle) .

    This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems. These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries. It has been attracting over 200 attendees with participants from more than 20 countries and regions worldwide. This workshop will be held as a single-track seminar to provide comprehensive information on the latest technologies and applications, as well as business opportunities.

    Satellite Workshop composed of invited seminars will also be arranged online after LTB-3D 2021 so as to discuss hot topics and current trends in low temperature bonding.

    Professor Dr. Naoteru Shigekawa
    Osaka City Univeristy
    Conference Chair

    Professor Dr. Tadatomo Suga
    Meisei University / The Univeristy of Tokyo
    IEEE EPS Japan Chapter

    Conference Scope:

    Roles of Low-temperature Bonding in 3D and Hetero-Integration

    Surface Activated Bonding (SAB) and its Extensions

    Hydrophilic and Plasma-assisted Bonding

    Metal and Hybrid Bonding

    New process for Low-temperature Bonding

    Power, RF, Photonic, and MEMS device Applications

    New Applications of Low-temperature Bonding

    Fundamentals and characterization

    Equipment and Quality Assessments

    Jpn. J.Appl. Phys.(JJAP) Special Issue:

      Authors of papers that are accepted and presented in LTB-3D 2021 are kindly advised to consider submission of their original papers on the significant part of their work presented at the workshop to a special issue of Japanese Journal of Applied Physics (JJAP) entitled "Low-temperature bonding for 3D integration."
      Details are here.