WaferBond 2021 EAST
2021 7th International Workshop
on Low Temperature Bonding for 3D Integration
Oct. 5-7, 2021
Nara, Nara-prefecture, Japan
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021) will be held from Oct. 5-7, 2021 at Nara-city, Japan.
The LTB-3D is a premier conference series sponsored by Institute for Advanced Micro-System Integration (IMSI), and cosponsored by the IEEE EPS Japan Chapter,
preceding 1st (2007), 2nd (2010), 3rd (2012), 4th (2014), 5th (2017) in Tokyo, and 6th (2019) in Kanazawa, and in coming 2021, moving to an attractive old city, Nara as WaferBond 2021 EAST
in conjunction with WaferBond conferences which are held in Europe every two years: 2009 (Grenoble), 2011 (Chemnitz), 2013 (Stockholm), 2015 (Braunschweig), and 2017 (Leuven), and 2019 (Halle) .
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB),
which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems.
These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries.
It has been attracting over 200 attendees with participants from more than 20 countries and regions worldwide.
This workshop will be held as a single-track seminar to provide comprehensive information on the latest technologies and applications, as well as business opportunities.
Satellite Workshop composed of invited seminars will also be arranged online after LTB-3D 2021 so as to discuss hot topics and current trends in low temperature bonding.
Professor Dr. Naoteru Shigekawa
Osaka City Univeristy
Professor Dr. Tadatomo Suga
Meisei University / The Univeristy of Tokyo
IEEE EPS Japan Chapter
Roles of Low-temperature Bonding in 3D and Hetero-Integration
Surface Activated Bonding (SAB) and its Extensions
Hydrophilic and Plasma-assisted Bonding
Metal and Hybrid Bonding
New process for Low-temperature Bonding
Power, RF, Photonic, and MEMS device Applications
New Applications of Low-temperature Bonding
Fundamentals and characterization
Equipment and Quality Assessments
Jpn. J.Appl. Phys.(JJAP) Special Issue:
Authors of papers that are accepted and presented in LTB-3D 2021 are kindly
advised to consider submission of their original papers on the significant
part of their work presented at the workshop to a special issue of
Japanese Journal of Applied Physics (JJAP) entitled
"Advances in low-temperature bonding for 3D integration."
Details would be announced later.