Institute for Advanced Micro-system Integration
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Overview

Overview

The Institute for Advanced Micro-System Integration (IMSI) is Japan's first industry-academia collaborative organization in the field of electronic packaging, established in 1997 by 10 semiconductor companies with the aim of systematizing and disseminating technologies for low temperature bonding that could become the world standard. Its activities span the 1st to 7th periods, and have reached the current 8th period.
Based on industry-academia collaboration, we have developed integrated design technology for ultra-high-speed signal transmission and high-density integrated systems, as well as next-generation bonding technology such as room temperature bonding and bumpless interconnect.
We have filed about 30 patent applications. In 1998, an endowed chair was established at the University of Tokyo to provide education on packaging engineering, invite leading researchers from overseas, dispatch researchers and students, and promote human resource development and international exchange. In June 2016, our organization was registered as an a non-profit general incorporated association and restarted with the aim of strengthening industry-academia-government collaboration, responding to globalization, and clarifying operations.

Business Content

Our institute is engaged in the following projects to achieve the above objectives.
(1) Industry-academia collaboration and research on electronic packaging technology and its engineering systematization
(2) Industry-academia collaboration and research on promoting the development of electronic packaging technology
(3) Industry-academia collaboration and research on other packaging technologies
In particular, as electronic packaging technologies, in the first phase of the consortium, proposals for ultra-high-speed signal transmission systems and bumpless interconnects based on room temperature bonding and basic studies of fundamental technologies were made, and in the second phase, based on the results and patents of the first phase. We develop fundamental technologies assuming applications, and from the 3rd period onward, we aim to implement next-generation matrix devices that take advantage of the de facto achievements and leading merits of the past results, and integrated design of ultra-high-speed signal transmission and ultra-high density integrated systems. In addition to completing the technology, we are developing applications that take advantage of the advancement of past achievements such as room temperature bonding and bumpless interconnects, and are expanding into the power electronics module field.
In 2020, our organization absorbed and merged the University – Industry Cooperative Research Committee for Innovative Interface Bonding Technology in the Japan Society for the Promotion of Science (JSPS) to further expand the range of activities and became the host organization of the International Workshop on Low Temperature Bonding for 3D Integration (LTB3D).