Original peer-reviewed regular papers discussing advances in low-temperature bonding technologies shall be collectively published in Selected Topics in Applied Physics (STAP) of Japanese Journal of Applied Physics (JJAP) entitled "Advances in low-temperature bonding technologies for 3D integration" in February 2015. Researchers and engineers in the relevant technological fields are encouraged to submit their achievements to STAP. Electrical archives of STAP papers shall be freely accessed on JJAP webpage. Deadline for submission is the end of July 2014. This STAP project proceeds in collaboration with LTB-3D 2014. Thus contributors to workshop are strongly encouraged to add discussions to their presentations and submit them to the STAP. Details for submission process to JJAP/STAP are found at JJAP website

Chief Guest Editors: Prof. Tadatomo Suga (University of Tokyo)
Prof. Naoteru Shigekawa (Osaka City University)

Important date:

Submission deadline: Aug. 7th , 2014
Publication: February 2015
JJAP website


Topics:
Roles of Low-temperature Bonding in 3D & Hetero-Integration
Marketing, 3D Architectures, Efficiency for 3D CMOS Integration, Impact for EDA Perspective, OSAT Point of View
Bonding technology for 3D & Hetero-Integration
Wafer-to-Wafer Bonding, Die-to-Wafer Bonding, Cu Hybrid Bonding, Temporary Bonding & De-bonding, Polymers for Wafer Level Packaging
Hydrophilic & Plasma-assist Bonding and its Applications
Oxide Fusion Bonding, Wafer-Level Hermetic Bonding, Si Photonics, Hetero-integration of Optoelectronic Systems, BSI CMOS Image Sensors , Nano-Micro Fluidics Application
Surface Activated Bonding(SAB)
Overview of SAB for Room-Temperature Bonding, Metal-metal direct bonding at room temperature, Optical Micro Sensors, Frequency-Conversion Devices and Solid-State Lasers, Magneto-Optic Garnet for Waveguide Optical Isolator, InP/Si Bonding for On-chip Optical Interconnection, Bio-medical Device Applications
New Application of Low Temperature Bonding
Power-electronics Module Packaging, OELD and Lighting Devices Sealing, SiC-, AlN-Bonding for Power Electronic Devices, Direct-bonded Tandem Solar Cells
New Processes for Low-Temperature Bonding
Vapor-Assisted Surface Activation Method, Water Containing Plasma Activation, Atomic Diffusion Bonding, Low temperature bonding using Formic Acid, Bonding of CNT to Metal for Vertical Interconnection
New Aspect of Solder and Eletro-plating Technologies for 3D integration Solder/Adhesive Bonding, Lead-free Bonding with Hydrogen-radical Treatment

SAB Tools for Volume Production


JJAP website