![]() |
|
Home | Home Japanese | Sessions and Keynotes | Author's Info | Download
Program | Social Event | Hotel | Location | Registration Committee | Sponsors | Contact |JJAP/STAP |
|
Presentations should cover the newest trend of 3D integration, fundamentals and new processes of interconnects, and development of low-temperature bonding. To activate lively and fruitful discussion, we will submit the proceedings containing selected abstracts electrically in IEEE Xplore, while a technical digest consisting of abstracts and presentation materials will be distributed to all the participants. Only 20-30 presentations including invited papers will be selected for long oral presentation (20-30 min) because of the limited capacity of the sessions. The other selected contributions are to be presented by short oral presentation (5 min) combined with poster presentations. IMPORTANT DATES
SUBMISSION OF ABSTRACTS Authors must submit electronically one-page abstract in pdf format via email or via website. Authors must use the IEEE double-column format indicated in the MS Word Template. Authors will receive electronic notification of acceptance or rejection, and long resentation or short presentation. Please download author's instruction.
CAMERA-READY MANUSCRIPT AND PRESENTSTION MATERIALS Authors of accepted presentation must send improved camera-ready abstracts in pdf format and presentation materials (PowerPoints slides) in pdf or ppt format via email or via website below. Authors should also submit a copyright form, necessary for publication by IEEE. Technical digests including all abstracts and presentation materials will be distributed to all participants . One-page abstracts will be submitted to IEEE Xplore
Please download author's instruction.
CAMERA-READY SUBMISSION INSTRUCTIONS
|