LTB-3D Conference Committee
Steering Committee
T. SUGA, Meisei University (General Chair)
H. TAKAGI, AIST (Organizing Committee Chair)
N. SHIGEKAWA, Osaka Metropolitan University (Organizing Committee Vice Chair)
T. SHIMATSU. Tohoku University (Organizing Committee Vice Chair)
R. TAKIGAWA, Kyushu Univeristy (Organizing Committee vice Chair)
T. MATSUMAE, AIST (Technical Program Chair)
N. TOYODA, University of Hyogo (Technical Program vice Chair)
E. HIGURASHI, Tohoku University (Publication Chair)
K. TAKEUCHI, Tohoku University (Publication Vice Chair)
J. S. WANG, Meisei University (Local Arrangement Chair)
M. FUJINO, IME A’STAR
H. ISHIDA, SUSS Micro Teck
N. KAWAMATA, IMSI (Conference Treasurer, Conference Secretary)
Advisory Committee
Jamal Deen, McMaster University (Canada), Professor
Jenn-Ming Song, National Chung Hsing University (Taiwan), Professor
Chuan Seng Tan, Nanyang Technological University (Singapore), Professor
Helmut Baumgart, Old Dominion University (USA), Professor
Karl D. Hobalt, Naval Research Lab (USA), Supervisory Electrical Engineer
Li Min, Shanghai JiaoTong University (China), Professor
Rolf Aschenbrenner, Fraunhofer IZM (Germany), Deputy Director
Frank Fournel, CEA-LETI (France), Director
Roy Knechtel, Schmalkalden University of Applied Science (Germany), Professor
Xinhua Wang, CAS IME
Fengwen Mu, iSABers Co. Ltd.
Local Organizing Committee
Low Temperature Bonding Technology Committee, Institute for Advanced
Micro-System Integration (IMSI)