Author's Information
Presentations should cover the newest trend of 3D integration, fundamentals and new processes of interconnects, and development of low-temperature bonding. To activate lively and fruitful discussion, the conference proceeding consisting of original one-page summaries will be distributed to all the participants and will be submitted to IEEE Xplore. Copyright of one-page summaries will be transferred to IEEE. Presentation materials (PowerPoint slides formatted in “6 slides per page” style) will be distributed only to the participants on site to make presentation more comprehensively understood.
IMPORTANT DATES
- Manuscript (one-page summary) Submission Deadline: Jan. 16, 2026
- Acceptance/Rejection Notification: Feb. 19, 2026
- Improved final version of one-page summary and Presentation Materials Deadline: Apr. 6, 2026
- Conference: May 13-15, 2026
SUBMISSION OF MANUSCRIPTS (ONE-PAGE SUMMARY)
Authors must submit electronically one-page summary in pdf format via website. Usage of the IEEE double-column format indicated in the MS Word Template is mandatory. Authors will receive electronic notification of acceptance or rejection together with comments on their one-page summary.
Submit abstract: here
Please download instruction for authors as template for one-page summary.