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LTB-3D 2024 Awards

Best Presentation Award

is delivered to the paper entitled

Surface Activated Cu/SiO₂ Hybrid Bonding for Room Temperature 3D Integration

K. Abadie¹, P. Renaud¹, F. Fournel¹, L. G. Michaud², M. Danner², M. Dornetshumer², C. Lecouvey¹, A-M Papon¹, I. Chevalier¹, T. Monniez¹, C. Matei¹, T. David1, S. Dominguez¹, and C. Dubarry^1
1 Univ. Grenoble Alpes, CEA, LETI, ² EV Group

Best Poster Presentation Awards

are delivered to the papers entitled

Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films

H. Iemura^1,2, M. Uomoto¹, and T. Shimatsu^1,3
1 Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University, ² Department of Electronic Engineering, Graduate School of Engineering, Tohoku University ³ Research Institute of Electrical Communication (RIEC) , Tohoku University

Heat Dissipation Characteristics of GaN-on-Polycrystalline-Diamond HEMTs

C. Moriyama¹, Y. Sakaida², H. Uratani², Y. Ohno³, K. Inoue³, Y. Nagai³, N. Shigekawa¹, and J. Liang^1
1 Graduate School of Engineering, Osaka Metropolitan University, ² SiC Division, Air Water Inc., 3Insitute for Materials Research (IMR), Tohoku University

100 GHz Thin-Film LNOI/Si Optical Modulator Fabricated by Room Temperature Wafer Bonding

S. Murakami¹, Y. Katoda¹, Y. Yamaguchi², T. Sakamoto³, R. Takigawa^1
1 Graduate School of Information Science and Electrical Engineering, Kyushu University ² National Institute of Information and Communications Technology (NICT) ³ Department of Electrical Engineering and Computer Science, Tokyo Metropolitan University