LTB-3D,Japan

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Sponsors

Sponsor

The IEEE Components, Packaging, and Manufacturing Technology Society

Cooperation

Institute for Advanced Micro-System Integration (IMSI)

Japan Institute of Electronics Packaging (JIEP)

The National Institute of Advanced Industrial Science and Technology

Financial support

SUSS MicroTec KK

TOKYO OHKA KOGYO CO., LTD.

Bondtech Co.,Ltd.

LANTECHNICAL SERVICE CO., LTD.

TOYO KOHAN CO., LTD.

Ayumi INDUSTRY CO., LTD.

Mitsubishi Heavy Industries Ltd.

Musashino Engineering CO.,LTD.

Applied Microengineering Ltd. (AML)

The New Technology Development Foundation

The Precise Measurement Technology Promotion Foundation

The background of the title logo LTB-2010 is taken from the pictures designed by Seikan Azuma.