Presentations should cover the newest trend of 3D integration, fundamentals and new processes of interconnects, and development of low-temperature bonding. To activate lively and fruitful discussion, we will publish the proceedings containing selected full papers only electrically in IEEE Xplore, while a technical digest consisting of powerpoint presentation materials will be distributed to all the participants. Only 20-30 presentations including invited papers will be selected for long oral presentation (20-30 min) because of the limited capacity of the sessions. The other selected contributions are to be presented by short oral presentation (5 min) combined with poster presentations.

IMPORTANT DATES

Authors of accepted presentation must send a one-page revised abstract in pdf format and presentation materials in pdf or ppt format via email or via website below. Authors are recommended to submit a full paper (4-6 pages, IEEE format), even though it is not mandatory, thus, authors choose whether or not to publish details of their work in IEEE Xplore. Technical digests including all abstracts and presentation materials will be distributed to all participants with CD-ROM. Full papers or one-page abstracts will be published electronically in IEEE Xplore. For additional details on preparing the final paper, please consult the IEEE Editorial Style Manual.

IMPORTANT: If you submit a full 4-6 page paper, your one-page abstract will be included not in IEEE Xplore, but in the Technical Digest CD-ROM, which will be distributed at the symposium. Papers submitted, but finally not presented at the symposium, will not be published in IEEE Xplore.

Please download authors instruction.

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