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Important Dates

• Manuscript (one-page summary) Submission Deadline: Jan. 16, 2026
• Acceptance/Rejection Notification: Feb. 19, 2026
• Improved final version of one-page summary and Presentation Materials Deadline: Apr. 6, 2026
• Conference: May 13-15, 2026

©石川県観光連盟

Sponsored by

Institute for Advanced Micro-System Integration (IMSI)

Technical Co-Sponsored by

IEEE	IEEE EPS Japan Chapter

2026 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2026 Satellite in Kanazawa) will be held in May 13-15, 2026, in Kanazawa-city, Japan.

The LTB-3D is a premier conference series sponsored by General Incorporated Non-profit Association - Institute for Advanced Micro-System Integration (IMSI), and in collaboration with ECS Symposium on Semiconductor Wafer Bonding and WaferBond conferences held in Europe.

Preceding LTB-3D workshop was held in Tokyo in its 1st (2007), 2nd (2010), 3rd (2012), 4th (2014), and 5th (2017) versions, in Kanazawa in 6th (2019) version, online in 7th version. Its 8th version (2024) was held in Nara-city. LTB-3D 2026 is given in Kanazawa as its satellite workshop.

This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems. These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries.

This workshop will be held as a single-track seminar to provide a compact forum for close and deep discussion of all aspects of low temperature bonding technologies – the latest technologies and applications, as well as business opportunities.

Conference Scope: