International Workshop on Low Temperature Bonding for 3D Integration

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WaferBond 2024 EAST

2024 8th International Workshop
on Low Temperature Bonding for 3D Integration
LTB-3D 2024

Oct. 30- Nov. 1, 2024
Nara, Nara-prefecture, Japan

Important date:

Manuscript (one-page summary) Submission Deadline: ~~June 21^st, 2024~~
July 4^th, 2024 (extended)
Acceptance/Rejection Notification: July 26^th, 2024
Improved final version of one-page summary and Presentation Materials Deadline: ~~Aug. 30^th~~ September 27th, 2024
Conferenece: Oct. 30^th-Nov. 1^st, 2024

By Nara-City

Our trip to Nara!

Sponsored by

Institute for Advanced Micro-System Integration (IMSI)

Technical Co-Sponsored by

IEEE	IEEE EPS Japan Chapter

Endorsed by

The Japan Society of Applied Physics

2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2024) will be held in Oct. 30-Nov. 1, 2024, in Nara-city, Japan.

The LTB-3D is a premier conference series sponsored by General Incorporated Non-profit Association - Institute for Advanced Micro-System Integration (IMSI), technically co-sponsored by The IEEE and The IEEE EPS Japan Chapter, and in collaboration with ECS Symposium on Semiconductor Wafer Bonding. Preceding LTB-3D workshop was held in Tokyo, Japan in its 1st (2007), 2nd (2010), 3rd (2012), 4th (2014), and 5th (2017) versions and in Kanazawa in 6th (2019) version. Its 7th version, LTB-3D 2021, was held online. LTB-3D 2024 is given in Nara, an ancient capital of Japan as WaferBond 2024 EAST in conjunction with WaferBond conferences which are held in Europe: 2009 (Grenoble), 2011 (Chemnitz), 2013 (Stockholm), 2015 (Braunschweig), 2017 (Leuven), 2019 (Halle/Saale), and 2021 (Schmalkalden).

This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems. These bonding technologies have been already used for the volume production and have potential applications in wide range of manufacturing industries. This workshop will be held as a single-track seminar to provide a compact forum for close and deep discussion of all aspects of low temperature bonding technologies – the latest technologies and applications, as well as business opportunities.

Professor Dr. Naoteru Shigekawa
Osaka Metropolitan Univeristy
Steering Committee Chair

Professor Dr. Tadatomo Suga
Meisei University / The Univeristy of Tokyo / IMSI
IEEE EPS Japan Chapter
General Conference Chair and Lead Organizer

Conference Scope:

Roles of Low-temperature Bonding in 3D and Hetero-Integration

Surface Activated Bonding (SAB) and its Extensions

Hydrophilic and Plasma-assisted Bonding

Metal and Hybrid Bonding

New process for Low-temperature Bonding

Power, RF, Photonic, and MEMS Device Applications

New Applications of Low-temperature Bonding

Fundamentals and Characterization

Equipment and Quality Assessments

Jpn. J.Appl. Phys.(JJAP) Special Issue:

Authors of papers that are accepted and presented in LTB-3D 2024 are kindly advised to consider submission of their original papers on the significant part of their work presented at the workshop to a special issue of Japanese Journal of Applied Physics (JJAP) entitled "Advances in low-temperature bonding for 3D integration." Details would be announced later.