Institute for Advanced Micro-system Integration
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Technologies

Surface Activated Bonding (SAB)

Surface Activated Bonding (SAB) is a unique process that strongly joins two similar/dissimilar smooth surfaces cleaned by an Ar fast atom beam, an Ar ion beam or a RF plasma in vacuum at room temperature. SAB can be applied to bonding between various materials such as metals, semiconductors, ceramics or plastics.
Surface Activated Bonding (SAB)

High Speed Transmission using Stacked Pair Lines

At least, pair wires require for electrical energy transmission.  Complementary current along the pair wires makes electromagneteic field transversely, that induces crosstalk noise when the field is crossing neighbor wires. For reducing crosstalk, pair wire coupling should maintain stronger. If the principal condition was kept, the high speed signal transmission enables such as 5GHz along 100mm length in FR-4 substrate.
High Speed Transmission using Stacked Pair Lines